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    Inside AT&S and the race to make the critical layer beneath AI chips●✉newsTechnologyAI1 h ago

    AT&S, the Austrian substrate manufacturer, is featured in a new report on the growing competition to produce advanced IC substrates, the critical layer that connects AI chips to circuit boards. The technology is becoming a bottleneck as demand for AI accelerators surges, and companies and governments are racing to expand capacity and secure supply of these components.