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    AT&S and the race to build the substrate layer under AI chips●Inside AT&S and the race to make the critical layer beneath AI chips✉newsTechnologyAI41 min ago

    AT&S, the Austrian circuit-board maker, is drawing attention for its role in producing advanced substrates — the critical layer that connects AI chips to circuit boards. As demand for artificial intelligence hardware surges, chipmakers face a bottleneck in substrate supply, and AT&S is among the companies racing to expand capacity for this often-overlooked component.