{"ok":true,"trend":{"id":364159,"platform":"news","region":"global","key":"chip industry technical paper roundup: sept. 29","title":"Chip Industry Technical Paper Roundup: Sept. 29","url":"https://news.google.com/rss/articles/CBMif0FVX3lxTE5ITUlmNjB5Zk9EdGRfVGZxUjEtTUpCTTdCUzk3RUF1SGI2VTFjQmczSmpWRnB6eG1fbEdyTGV3elZzQXlYVGd2N25Db1R0aS1JNG1vbV9ZcFpCLTY1VTBWdnJwcDB5OHg2VFhuYmNWQV9CeWN3LVRnRmtQYTEyNU0?oc=5","first_seen":"2026-09-29T13:43:54.528637Z","last_seen":"2026-09-29T13:43:54.528637Z","last_rank":29,"peak_rank":29,"last_volume":null,"peak_volume":null,"seen_count":1,"score":5.7475,"category_hint":"semiconductors","section":"technology","category":"semiconductors","summary":"Semiconductor Engineering has released its latest roundup of technical papers from across the chip industry, dated Sept. 29. The compilation gathers recent research and engineering publications covering semiconductor design, manufacturing and packaging developments. The roundup serves as a regular digest for engineers and industry professionals tracking the latest technical literature in the semiconductor field.","why":"Industry professionals follow these periodic technical paper digests to keep up with new semiconductor research.","tone":"neutral","entities":["Semiconductor Engineering","semiconductor industry"],"summarized_at":"2026-09-29T13:45:57.606301Z","meta":{"via":"scan","lang":"en","term":"chips","source":"Semiconductor Engineering","published":"Tue, 29 Sep 2026 08:36:39 GMT"},"nw":null,"promo":null,"kind":null,"importance":null,"hidden":false,"hide_reason":null,"judged_at":null,"title_en":"Chip Industry Technical Paper Roundup Published for Sept. 29","section_name":"Technology","category_name":"Semiconductors","timeline":[{"captured_at":"2026-09-29T13:43:54.528637Z","rank":29,"volume":null}],"posts":[{"platform":"news","url":"https://news.google.com/rss/articles/CBMif0FVX3lxTE5ITUlmNjB5Zk9EdGRfVGZxUjEtTUpCTTdCUzk3RUF1SGI2VTFjQmczSmpWRnB6eG1fbEdyTGV3elZzQXlYVGd2N25Db1R0aS1JNG1vbV9ZcFpCLTY1VTBWdnJwcDB5OHg2VFhuYmNWQV9CeWN3LVRnRmtQYTEyNU0?oc=5","author":"Semiconductor Engineering","title":"Chip Industry Technical Paper Roundup: Sept. 29","snippet":null,"posted_at":"2026-09-29T08:36:39Z","likes":null}],"elsewhere":[],"window":"7d"}}