{"ok":true,"trend":{"id":33829,"platform":"news","region":"global","key":"inside at&s and the race to make the critical layer beneath ai chips","title":"Inside AT&S and the race to make the critical layer beneath AI chips","url":"https://news.google.com/rss/articles/CBMigAFBVV95cUxNMG10LUtTNmJYUmxHYlR6T2QtRTU2MkhUWFAyY2VPSzI1Vk5jYkxqMGxwT3B2NVlKdGNtWnZDeXczeDhaSTJmcmJlSGhYNmlfMktic1huNG9mdVBpcWRPbnpuaGFpWXpNaHJPODcyVFlZVXVQSnVEQ0FzS3Jpbi1YMg?oc=5","first_seen":"2026-09-26T22:43:40.625722Z","last_seen":"2026-09-27T00:12:41.126179Z","last_rank":2,"peak_rank":2,"last_volume":null,"peak_volume":0,"seen_count":3,"score":79.14,"category_hint":"semiconductors","section":"technology","category":"ai","summary":"AT&S, the Austrian circuit-board maker, is drawing attention for its role in producing advanced substrates — the critical layer that connects AI chips to circuit boards. As demand for artificial intelligence hardware surges, chipmakers face a bottleneck in substrate supply, and AT&S is among the companies racing to expand capacity for this often-overlooked component.","why":"Growing AI chip demand has put a spotlight on substrate shortages and the companies that make them.","tone":"neutral","entities":["AT&S","AI chipmakers"],"summarized_at":"2026-09-26T22:45:41.831675Z","meta":{"via":"scan","lang":"en","term":"chips","source":"CNBC","generic":0.09,"published":"Sat, 26 Sep 2026 21:30:43 GMT"},"nw":0.7,"promo":0.03,"kind":"news_event","importance":1.84,"hidden":false,"hide_reason":null,"judged_at":"2026-09-26T22:43:40.945221Z","title_en":"AT&S and the race to build the substrate layer under AI chips","section_name":"Technology","category_name":"AI","timeline":[{"captured_at":"2026-09-26T22:43:40.625722Z","rank":33,"volume":null},{"captured_at":"2026-09-26T22:50:40.382197Z","rank":2,"volume":null},{"captured_at":"2026-09-27T00:12:41.126179Z","rank":2,"volume":null}],"posts":[{"platform":"news","url":"https://news.google.com/rss/articles/CBMigAFBVV95cUxNMG10LUtTNmJYUmxHYlR6T2QtRTU2MkhUWFAyY2VPSzI1Vk5jYkxqMGxwT3B2NVlKdGNtWnZDeXczeDhaSTJmcmJlSGhYNmlfMktic1huNG9mdVBpcWRPbnpuaGFpWXpNaHJPODcyVFlZVXVQSnVEQ0FzS3Jpbi1YMg?oc=5","author":"cnbc.com","title":"Inside AT&S and the race to make the critical layer beneath AI chips","snippet":null,"posted_at":"2026-09-26T21:59:42Z","likes":null}],"elsewhere":[],"window":"7d"}}