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    Data centres running AI hardware are increasingly adopting near-total liquid cooling for high-density racks, as traditional air cooling can no longer handle the heat output of modern accelerators. Engineers and industry observers are discussing how direct liquid cooling is becoming the default design choice for new AI infrastructure deployments.

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    Jinfu Technology raises $44M for liquid-cooling expansion▼Jinfu Technology raises $44M to fund liquid-cooling expansion✉newsTechnology1 d ago

    Jinfu Technology has raised $44 million in new funding that it will use to expand its liquid-cooling business. The company supplies cooling technology increasingly needed for data centres and high-performance computing, where rising energy demands are driving demand for more efficient thermal management. The investment signals continued investor interest in infrastructure supporting AI-driven computing growth.

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    UL Solutions Launches Certification for AI Data Center Liquid Cooling●UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers✉newsTechnologySemiconductors8 min ago

    UL Solutions has introduced a certification program for direct-to-chip liquid cooling equipment used in AI data centers. The program aims to help manufacturers verify the safety and performance of cooling systems as AI workloads drive higher heat densities and demand for advanced thermal management. Details on participating companies were not immediately available.