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- 1Samsung to more than double HBM4 chip output●Samsung is expected to more than double output of its HBM4 and HBM4E DRAM
Samsung is expected to more than double its output of HBM4 and HBM4E high-bandwidth memory DRAM, according to sources cited by South Korean outlet Sedaily. The expansion signals Samsung's push to scale up next-generation memory supply amid booming demand from AI chipmakers, where it faces intense competition with SK Hynix in the high-bandwidth memory market.
- 2AT&S and the race to build the substrate layer under AI chips●Inside AT&S and the race to make the critical layer beneath AI chips
AT&S, the Austrian circuit-board maker, is drawing attention for its role in producing advanced substrates — the critical layer that connects AI chips to circuit boards. As demand for artificial intelligence hardware surges, chipmakers face a bottleneck in substrate supply, and AT&S is among the companies racing to expand capacity for this often-overlooked component.
- 3
AMD's market value crossed $1 trillion for the first time, briefly placing the chipmaker in an elite group long dominated by rival Nvidia. The milestone caps years of AMD being seen as the perpetual underdog in semiconductors, and commenters note it now poses a genuine challenge to Nvidia's lead in AI chips. Analysts are watching whether the valuation can hold amid volatile AI-driven trading.
- 4Samsung and SK Join the Co-Packaged Optics Race for AI Chips▼[ChipTalk] AI Semiconductors Now Compete at the Speed of Light...Samsung and SK Join the CPO Race
Korean chip giants Samsung Electronics and SK Hynix are moving into co-packaged optics (CPO) technology, which links AI semiconductors using optical connections to boost data transfer speeds and energy efficiency. As AI computing demand surges, Korean media describe the shift as a new race in which chips compete 'at the speed of light', alongside global players developing similar interconnect solutions.
- 5Nvidia's Huang Pledges to Double Chip Supply, Securing 37% of HBM▼Huang’s 2x Chip Vow Locks Up 37% of HBM Supply [2026]
Jensen Huang has reportedly committed to doubling chip supply, a move that would lock up roughly 37% of the world's high-bandwidth memory (HBM) output for 2026. The pledge underscores Nvidia's aggressive push to secure memory for its AI accelerators amid shortages, leaving rival chipmakers competing for the remaining HBM capacity from suppliers like SK Hynix, Samsung and Micron.
- 6Jensen Huang: AI labs that can't control their systems must close●Jensen Huang: AI Labs That Can’t Control Their Systems Must Close
Nvidia CEO Jensen Huang says AI laboratories that cannot control the systems they build should be shut down. The remarks, reported by Gadget Review, add a prominent industry voice to the ongoing debate over AI safety and accountability. Huang's position suggests that the ability to manage and contain advanced AI models should be a baseline requirement for any lab developing them.